About Us
Xiamen Pinhe Precision Technology Co., Ltd. is located in Xiamen, Fujian Province. It is a national high-tech enterprise dedicated to the research and production of stone multi line cutting machines, and is also one of the earliest companies in China to start the research and development of stone wire saws. The predecessor of the company was a production and research and development unit for multi line cutting machines for photovoltaic silicon wafers. The core members of the team have over 18 years of experience in multi line cutting machines and production and research and development of stone machinery. The company started developing specialized stone wire saws in 2018 and has since iterated and mass-produced up to the 6th generation. The second-generation wire saw product has been in stable operation for 5 years since it was put into production in 2020. The R&D department of the company has collaborated with multiple research institutions such as Xiamen University and Jimei University, and has obtained over 40 inventions and utility models. The products have been shortlisted for the first set of catalogs in Fujian Province twice, and have received awards and subsidies from relevant science and technology departments at the provincial and municipal levels. In 2023, they passed the product appraisal by experts from the China Machinery Industry Federation, confirming that the technology of Pinhe wire saw products has reached the domestic level.
After the official exposure of the Pinhe wire saw in Shuitou, Fujian in 2022, the product instantly caused a sensation in the industry, receiving unanimous praise from relevant units, research institutions, and customers, and igniting a wave of stone cutting technology. Domestic related enterprises have entered the field to jointly research and explore, making great contributions to the technological upgrading and innovation of the stone industry.
More
- SIXyears
- The company has a 6-year development history
- one hundredmultiple
- Utility Model
- sixtyspecies
- Equipment
Stone processing
6 major advantages 1. High yield: saw seam of 0.5mm, yield rate exceeding 97%, high yield rate: saw seam of 0.5mm, yield rate exceeding 97% 2. Ultra thin: capable of processing ultra-thin plates with a thickness of 2mm, ultra-thin: capable of processing ultra-thin plates with a thickness of 2mm 3. Environmental Protection: Reduce stone waste by over 80%. Ecological Environment Protection: Reduce stone waste by over 80% 4. Safety: High precision, never pulling the board 5. Noise reduction: no vibration, noise reduction of more than 40 decibels, noise reduction: no vibration, noise reduction of more than 40 decibels 6. Space saving: equipment footprint reduced by over 30%, space saving: equipment footprint reduced by over 30%
More
Marble processing
6 major advantages 1. High yield: saw seam of 0.5mm, yield rate exceeding 97%, high yield rate: saw seam of 0.5mm, yield rate exceeding 97% 2. Ultra thin: capable of processing ultra-thin plates with a thickness of 2mm, ultra-thin: capable of processing ultra-thin plates with a thickness of 2mm 3. Environmental Protection: Reduce stone waste by over 80%. Ecological Environment Protection: Reduce stone waste by over 80% 4. Safety: High precision, never pulling the board 5. Noise reduction: no vibration, noise reduction of more than 40 decibels, noise reduction: no vibration, noise reduction of more than 40 decibels 6. Space saving: equipment footprint reduced by over 30%, space saving: equipment footprint reduced by over 30%
More
Rock processing
6 major advantages 1. High yield: saw seam of 0.5mm, yield rate exceeding 97%, high yield rate: saw seam of 0.5mm, yield rate exceeding 97% 2. Ultra thin: capable of processing ultra-thin plates with a thickness of 2mm, ultra-thin: capable of processing ultra-thin plates with a thickness of 2mm 3. Environmental Protection: Reduce stone waste by over 80%. Ecological Environment Protection: Reduce stone waste by over 80% 4. Safety: High precision, never pulling the board 5. Noise reduction: no vibration, noise reduction of more than 40 decibels, noise reduction: no vibration, noise reduction of more than 40 decibels 6. Space saving: equipment footprint reduced by over 30%, space saving: equipment footprint reduced by over 30%
More
Board stone processing
6 major advantages 1. High yield: saw seam of 0.5mm, yield rate exceeding 97%, high yield rate: saw seam of 0.5mm, yield rate exceeding 97% 2. Ultra thin: capable of processing ultra-thin plates with a thickness of 2mm, ultra-thin: capable of processing ultra-thin plates with a thickness of 2mm 3. Environmental Protection: Reduce stone waste by over 80%. Ecological Environment Protection: Reduce stone waste by over 80% 4. Safety: High precision, never pulling the board 5. Noise reduction: no vibration, noise reduction of more than 40 decibels, noise reduction: no vibration, noise reduction of more than 40 decibels 6. Space saving: equipment footprint reduced by over 30%, space saving: equipment footprint reduced by over 30%
More
News
-
- Company News
The medium wire cutting machine is mainly composed of three parts: machine tool, numerical control system, and high-frequency power supply. The numerical control system consists of a microcontroller, keyboard, and frequency conversion detection system, and has main functions such as gap compensation, linear interpolation, arc interpolation, and automatic wire breakage processing. Capable of cutting materials such as high-strength, high toughness, high hardness, high brittleness, magnetic materials, as well as precision small and complex shaped parts. Wire cutting technology and wire cutting machine tools are widely used in various industries.
(1) Bearings. The bearings of mining machinery bear all the load of the machine, so good lubrication has a great relationship with the bearing life. It directly affects the service life and operation rate of the machine. Therefore, it is required that the injected lubricating oil must be clean and the seal must be good.
(2) Newly installed wheels are prone to looseness and must be checked regularly.
Diamond wire cutting is the main method of silicon wafer cutting, mainly using electroplated diamond wire. Electroplated diamond wire is a linear sawing tool made by adding a certain amount of diamond abrasive to the plating solution. When the metal ions in the plating solution are reduced to metal in the cathode and deposited on the wire saw substrate, diamond particles are encapsulated into the coating.
Analysis of Diamond Wire Cutting Technology
2018-04-09
According to the production process, diamond wire can be divided into electroplated diamond wire cutting and resin diamond wire. Diamond cutting wire is made by coating diamond on steel wire through a certain method. Through a diamond cutting machine, the diamond cutting wire can form relative grinding motion with the object, thereby achieving the purpose of cutting.
Diamond wire is a method of composite electroplating that solidifies high hardness and high wear resistance diamond micro powder onto a steel wire substrate to produce bonded abrasive diamond saw wire. During the cutting process, 90% of the tensile strength comes from steel wire, so steel wire is crucial for diamond wire.
Metal laser cutting machines can be used for cutting various materials, and in recent years, the cutting application of copper products has gradually become popular. Regarding the cutting of copper products, many workers have many problems with the specific operation and parameter adjustment of metal laser cutting machines. Cutting not only requires mechanical cutting, but also requires experience. Below, DiNeng Laser will introduce how metal laser cutting machines cut copper materials in detail: